Z01
Datasheet
Standard 1 A Triacs
Features
A2
G
A1
A2
G
On-state rms current, IT(RMS) 1 A
•
Repetitive peak off-state voltage, VDRM/VRRM 600 or 800 V
•
Triggering gate current, IGT (Q1) 3 to 25 mA
Applications
A1
A2
•
A1
•
•
G A2
SOT-223
AC switching
Home appliances
TO-92
Description
The Z01 series is suitable for general purpose AC switching applications. These
devices are typically used in applications such as home appliances (electrovalve,
pump, door lock, small lamp control), fan speed controllers,...
A2
A1
G
Different gate current sensitivities are available, allowing optimized performance
when driven directly through microcontroller.
SMBflat-3L
Product status link
Z01
Product summary
IT(RMS)
1A
VDRM/VRRM
600, 800 V
IGTstandard
3 to 25 mA
DS2116 - Rev 11 - May 2019
For further information contact your local STMicroelectronics sales office.
www.st.com
Z01
Characteristics
1
Characteristics
Table 1. Absolute maximum ratings
Symbol
Parameters
ITSM
I2t
dl/dt
IGM
PG(AV)
Tstg
Tj
RMS on-state current (full sine wave)
Unit
1
A
Ttab = 90 °C
SOT-223
IT(RMS)
Value
TL = 50 °C
TO-92
SMBflat-3L
Ttab = 107 °C
Non repetitive surge peak on-state current
F = 50 Hz
tp = 20 ms
8
(full cycle, Tj initial = 25 °C)
F = 60 Hz
tp = 16.7 ms
8.5
I2t value for fusing
tp = 10 ms
Critical rate of rise of on-state current
A
0.35
A2s
F = 120 Hz
Tj = 125 °C
20
A/µs
tp = 20 µs
Tj = 125 °C
1
A
Tj = 125 °C
1
W
Storage junction temperature range
-40 to +150
°C
Operating junction temperature range
-40 to +125
°C
IG = 2 x IGT , tr ≤ 100 ns
Peak gate current
Average gate power dissipation
Table 2. Electrical characteristics (Tj = 25 °C, unless otherwise specified)
Value
Symbol
IGT(1)
Parameters
I - II - III
VD = 12 V, RL = 30 Ω
VGT
VGD
(2)
IH
IL
dV/dt(2)
(dV/dt)c(2)
Quadrant
VD = VDRM, RL = 3.3 kΩ, Tj = 125 °C
IV
Z01
Max.
Unit
03
07
09
10
3
5
10
25
5
7
10
25
mA
All
Max.
1.3
V
All
Min.
0.2
V
IT = 50 mA
Max.
7
10
10
25
I - III - IV
Max.
7
10
15
25
II
Max.
15
20
25
50
VD = 67 % VDRM gate open, Tj = 110 °C
Min.
10
20
50
100
V/µs
(dI/dt)c = 0.44 A/ms, Tj = 110 °C
Min.
0.5
1
2
5
V/µs
IG = 1.2 IGT
mA
mA
1. Minimum IGT is guaranteed at 5 % of IGT max.
2. For both polarities of A2 referenced to A1
DS2116 - Rev 11
page 2/16
Z01
Characteristics
Table 3. Static electrical characteristics
Symbol
VT(1)
VTO(1)
Rd
IDRM
IRRM
Test conditions
Tj
Value
Unit
ITM = 1.4 A, tp = 380 µs
25 °C
Max.
1.60
V
Threshold on-state voltage
125 °C
Max.
0.95
V
Dynamic resistance
125 °C
Max.
400
mΩ
5
µA
0.5
mA
Max.
value
Unit
25 °C
VDRM = VRRM
125 °C
Max.
1. For both polarities of A2 referenced to A1
Table 4. Thermal resistance
Symbol
Parameters
Rth(j-t)
Max. junction to tab (AC)
Rth(j-l)
Max. junction to lead (AC)
Rth(j-a)
Junction to ambient
Junction to ambient
(S(1)
= 5 cm²)
SOT-223
25
SMBflat-3L
14
TO-92
60
SOT-223
60
SMBflat-3L
75
TO-92
150
°C/W
1. Copper surface under tab.
DS2116 - Rev 11
page 3/16
Z01
Characteristics (curves)
1.1
Characteristics (curves)
Figure 1. Maximum power dissipation versus on-state
RMS current (full cycle)
Figure 2. RMS on-state current versus lead (TO-92) or tab
(SOT-223, SMBflat-3L) temperature (full cycle)
P(W)
1.2
1.50
IT(RMS)(A)
α =180 °
1.25
1.0
1.00
0.8
0.75
0.6
0.50
0.4
I T(RMS) (A)
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
Tlead or Ttab (°C)
0
1.0
25
50
75
100
125
Figure 4. Relative variation of thermal impedance versus
pulse duration (Zth(j-a))
Figure 3. On-state rms current versus ambient
temperature(free air convection full cycle)
1.2
TO-92
0.0
0.00
0.0
SOT-223
0.2
180°
0.25
SMBflat-3L
K=[Z th(j-a) /Rth(j-a) ]
IT(RMS)(A)
1.00
Z01xxA
1.0
Rth(j-a) = 60°C/W
(SOT-223)
Z01xxMUF
Copper surface area
= 5cm²
0.8
Rth (j-a) = 100°C/W
(SMBflat-3L)
0.6
0.10
Z01xxN
Rth(j-a) = 150°C/W
(TO-92)
0.4
0.2
t p (s)
Tamb (°C)
0.01
0.0
0
DS2116 - Rev 11
25
50
75
100
125
1.0E-03
1.0E-02
1.0E-01
1.0E+00
1.0E+01
1.0E+02
1.0E+03
page 4/16
Z01
Characteristics (curves)
Figure 5. Relative variation of holding current and
latching current versus junction temperature (typ. values)
IH, IL [Tj] /IH, IL [Tj =25°C]
2.5
Figure 6. Relative variation of gate trigger current (IGT)
and voltage (VGT) versus junction temperature
IGT, V GT[T j ] / IGT, V GT[T j =25 ° C]
3.0
2.5
2.0
IGT Q1-Q2
IGT Q3
2.0
1.5
IGT Q4
1.5
1.0
1.0
IL
0.5
0.0
-50
-25
0
25
0.5
IH
Tj (°C)
50
75
VGT Q1-Q2-Q3-Q4
100
125
Figure 7. Surge peak on-state current versus number of
cycles
-25
0
25
50
75
100
125
Figure 8. Non-repetitive surge peak on-state current and
corresponding value of I2t sinusoidal pulse width
ITSM(A)
9
Tj (°C)
0.0
-50
ITSM (A), I2t (A 2s )
100. 0
8
Tj initial = 25°C
dI/dt li mi tati on :
20A/µs
T = 20 ms
7
ITSM
One cy cle
Non repetitive
Tjinitial = 25 °C
6
10. 0
5
4
1. 0
3
I2t
2
Repetitive
Tamb = 95 °C
1
Number of cycles
0
1
10
100
1000
Figure 9. On-state characteristics (maximum values) (ITM
= f(VTM)
1. 00
10. 00
(dI/dt )c [(d V/dt )c] / Specifie d (dI/dt )c
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
Tj = Tjmax.
1.0
Tj=max.
Vt0=0.95 V
Rd=400 mΩ
Tj = 25°C
VTM (V)
0.1
0.5
DS2116 - Rev 11
0. 10
Figure 10. Relative variation of critical rate of decrease of
main current (dI/dt) versus junction temperature
ITM(A)
10.0
0.0
t p ( ms )
0. 1
0. 01
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0.1
Z0109
Z0103
Z0107
(dV/dt )c (V/µs)
1 .0
10.0
Z0110
100.0
page 5/16
Z01
Characteristics (curves)
Figure 12. SOT-223 and SMBflat-3L thermal resistance
junction to ambient versus copper surface under case
Figure 11. Relative variation of critical rate of decrease of
main current (dI/dt) versus junction temperature
(dI/dt )c [Tj ] / (dI/dt )c [Tj S pecifie d]
170
6
Rth(j-a )( °C/W)
160
150
5
140
130
4
SMBflat-3L
120
3
110
2
90
100
SOT223
80
1
0
0
70
Tj (°C)
25
50
60
75
100
SCU( cm²)
50
125
0
1
2
3
4
5
Figure 13. Relative variation of static dV/dt immunity versus junction temperature (gate open)
6
dV/dt [ T j ] / dV/dt [ T j =125 °C]
VD=VR=402V
5
4
3
2
1
T j (°C)
0
25
DS2116 - Rev 11
50
75
100
125
page 6/16
Z01
Package information
2
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
2.1
SOT-223 package information
•
•
Epoxy meets UL94, V0
Lead free plating + halogen-free molding resin
Figure 14. SOT-223 package outline
V
A
A1
c
B
e1
D
B1
4
H
E
1
2
3
e
DS2116 - Rev 11
page 7/16
Z01
SOT-223 package information
Table 5. SOT-223 package mechanical data
Dimensions
Ref.
Inches(1)
Millimeters
Min.
Typ.
A
Max.
Min.
Typ.
1.80
A1
0.02
0.10
Max.
0.0709
0.0008
0.0039
B
0.60
0.70
0.85
0.024
0.0276
0.0335
B1
2.90
3.00
3.15
0.114
0.1181
0.1240
c
0.24
0.26
0.35
0.009
0.0102
0.0138
D
6.30
6.50
6.70
0.248
0.2559
0.2638
e
2.3
0.0906
e1
4.6
0.1811
E
3.30
3.50
3.70
0.130
0.1378
0.1457
H
6.70
7.00
7.30
0.264
0.2756
0.2874
V
10° max.
1. Inches only for reference
Figure 15. SOT-223 footprint (dimensions in mm)
3.25
1.32
5.16
7.80
1.32
2.30
DS2116 - Rev 11
0.95
page 8/16
Z01
TO-92 package information
2.2
TO-92 package information
•
•
Epoxy meets UL94, V0
Lead free plating + halogen-free molding resin
Figure 16. TO-92 package outline
c
A
a
B
C
b
D
F
E
Table 6. TO-92 package mechanical data
Dimensions
Ref.
Inches(1)
Millimeters
Min.
A
Typ.
Max.
Min.
1.35
B
Typ.
0.0531
4.70
C
Max.
0.1850
2.54
0.1000
D
4.40
0.1732
E
12.70
0.5000
F
3.70
0.1457
a
0.50
0.0197
b
1.27
c
0.500
0.48
0.0189
1. Inches dimensions given for information
DS2116 - Rev 11
page 9/16
Z01
SMBflat-3L package information
2.3
SMBflat-3L package information
•
•
Epoxy meets UL94, V0
Lead-free package
Figure 17. SMBflat-3L package outline
A
c
e
D
b 2x
L2 2 x
L 2x
L1
E
E1
L1
L
L2
b4
Table 7. SMBflat-3L mechanical data
Dimensions
Ref.
Millimeters
Min.
DS2116 - Rev 11
Typ.
Inches
Max.
Min.
Typ.
Max.
A
0.90
1.10
0.035
0.044
b
0.35
0.65
0.014
0.026
b4
1.95
2.20
0.070
0.087
c
0.15
0.40
0.005
0.016
D
3.30
3.95
0.129
0.156
E
5.10
5.60
0.200
0.221
E1
4.05
4.60
0.159
0.182
L
0.75
1.50
0.029
0.060
L1
0.40
0.016
L2
0.60
0.024
e
1.60
0.063
page 10/16
Z01
SMBflat-3L package information
Figure 18. Footprint recommendations, dimensions in mm (inches)
5.84
(0.230)
0.51
(0.020)
2.07
(0.082)
2.07
(0.082)
0.51
(0.020)
1.20
(0.047)
3.44
(0.136)
1.20
(0.047)
mi lli met ers
(inc hes )
Figure 19. Footprint and connectors for SOT-223 or SMBflat-3L (dimensions in mm)
5.84
3.42
3.25
1.19
1.32
1.50
2.92
SOT-223
Solder resist
1.35
1.20
1.08
Solder lands
SMBF3L
7.80
2.07
2.22
SMBF3L
1.95
SMBF3L
2.07
0.61
0.51
0.46
1.30
1.20
1.08
Solder paste
1.47
1.32
1.19
Connector lin e
SOT-223
SOT-223
SOT-223
0.85
0.95
1.10
2.30
DS2116 - Rev 11
page 11/16
Z01
Ordering information
3
Ordering information
Figure 20. Ordering information scheme
Z 01 03 M A [BLANK] 1AA2
Triac series
Current
01 = 1 A
Sensitivity
03 = 3 mA
07 = 5 mA
09 = 10 mA
10 = 25 mA
Voltage
M = 600 V
N = 800 V
Package
A = TO-92
N = SOT-223
UF = SMBflat-3L
BLANK = Check Table 9. Ordering information
Packing mode
1AA2 = TO-92 bulk
2AL2 = TO-92 ammopack
5AL2 = TO-92 tape and reel
5AA4 = SOT-223 tape and reel 7”
6AA4 = SOT-223 tape and reel 13”
Blank = SMBflat-3L tape and reel 13”
DS2116 - Rev 11
page 12/16
Z01
Product selector
3.1
Product selector
Table 8. Product selector
Part Number
DS2116 - Rev 11
600
800
Z0103MA
Z0103NA
Z0103MN
Z0103NN
Z0107MA
Z0107NA
Z0107MN
Z0107NN
Z0109MA
Z0109NA
Z0109MN
Z0109NN
Z0110MA
Z0110NA
Z0110MN
Z0110NN
Sensitivity
Type
TO-92
3 mA
SOT-223
TO-92
5 mA
10 mA
25 mA
Z0103MUF
3 mA
Z0107MUF
5 mA
Z0109MUF
10 mA
Package
SOT-223
TO-92
Standard
SOT-223
TO-92
SOT-223
SMBflat-3L
page 13/16
Z01
Ordering information
3.2
Ordering information
Table 9. Ordering information
Order code(1)
Marking(1)
Package
Weight
Z01xxyA 1AA2
Z01xxyA 2AL2
Z01xxyA
TO-92
0.2 g
Z01xxyA 5AL2
Base qty.
Delivery mode
2500
Bulk
2000
Ammopack
2000
Z0103yN 5AA4
Z3y
1000
Z0103MN 6AA4
Z3M
4000
Z0107yN 5AA4
Z7y
Z0107MN 6AA4
Z7M
Z0109yN 5AA4
Z9y
1000
Z0109NN6AA4
Z9N
4000
Z0103MUF
Z3M
5000
Z0107MUF
Z7M
Z0109MUF
Z9M
SOT-223
SMBflat-3L
0.12 g
46.78 mg
1000
4000
Tape and reel
5000
5000
1. xx = sensitive, y = voltage, and check Figure 20. Ordering information scheme.
DS2116 - Rev 11
page 14/16
Z01
Revision history
Table 10. Document revision history
Date
Revision
Changes
Oct-2001
4
Last update.
10-Feb-2005
5
Package: TO-92 tape and reel delivery mode 5AL2 added.
Table 4 on page 2: typo. mistake corrected
09-May-2005
6
1. (dV/dt)c instead of (dI/dt)c
2. V/μs unit instead of A/ms
DS2116 - Rev 11
21-Apr-2006
7
Reformatted to current standard. Table 2 on page 2: Typo corrected. Values
for IGT split into two separate rows.
10-Oct-2010
8
Table 2: modified test conditions for (dV/dt)c. Changed “ambient” to “lead or
tab” in Figure 2.
20-Oct-2010
9
Package: SOT-223 13” tape and reel added = 6AA4.
14-Dec-2010
10
02-May-2019
11
Added package SMBflat-3L. Updated dimensions in Table 6.
Updated Figure 3 and Figure 12. Updated Table 5: Product Selector.
Updated Table 9. Ordering information.
Minor text changed.
page 15/16
Z01
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST
products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST
products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of
Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service
names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2019 STMicroelectronics – All rights reserved
DS2116 - Rev 11
page 16/16
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